The TDA6502TS/C5,118 is a 28-pin SSOP lead-frame SMT RF & wireless IC from NXP. It features a shrink small outline package with gull-wing leads and a maximum seated plane height of 2mm. The IC is designed for surface mount applications and is packaged in a plastic material. The TDA6502TS/C5,118 is a member of the MO-150AH Jedec package family.
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NXP TDA6502TS/C5,118 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 10.4(Max) |
| Package Width (mm) | 5.4(Max) |
| Package Height (mm) | 1.8(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-150AH |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP TDA6502TS/C5,118 to view detailed technical specifications.
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