PackagePDIP
MountingThrough Hole
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Technical Specifications
NXP TDA7052B/N1,112 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Package Length (mm)
9.8(Max)
Package Width (mm)
6.48(Max)
Package Height (mm)
3.2(Max)
Seated Plane Height (mm)
4.2(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Function
Speaker
Amplifier Type
Class-AB
Input Signal Type
Single
Output Signal Type
Differential
Output Type
1-Channel Mono
Maximum Output Current
1500mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA7052B/N1,112 Datasheet
Download the complete datasheet for NXP TDA7052B/N1,112 to view detailed technical specifications.
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