Smart card interface IC supporting EMV 2000/ISO 7816 standards. Features a 10 MHz clock frequency and operates with 3.3V or 5V supply voltages, with a maximum of 6.5V. Housed in a 32-pin LQFP package (7x7x1.4mm) with 0.8mm pin pitch, this surface-mount component offers a maximum power dissipation of 500mW and operates within a temperature range of -30°C to 85°C.
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NXP TDA8020HL/C1,118 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 7 |
| Package Width (mm) | 7 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BBA |
| Typical Operating Supply Voltage | 3.3|5V |
| Maximum Supply Current | 60mA |
| Maximum Clock Frequency | 10MHz |
| Standard Supported | EMV 2000/ISO 7816 |
| Maximum Power Dissipation | 500mW |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 6.5V |
| Min Operating Supply Voltage | 2.7V |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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