Smart card interface IC supporting EMV 2000/ISO 7816 standards. Features a 10 MHz clock frequency and operates with 3.3V or 5V supply voltages, with a maximum of 6.5V. Housed in a 32-pin LQFP package (7x7x1.4mm) with 0.8mm pin pitch, this surface-mount component offers a maximum power dissipation of 500mW and operates within a temperature range of -30°C to 85°C.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA8020HL/C1,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BBA
Typical Operating Supply Voltage
3.3|5V
Maximum Supply Current
60mA
Maximum Clock Frequency
10MHz
Standard Supported
EMV 2000/ISO 7816
Maximum Power Dissipation
500mW
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
6.5V
Min Operating Supply Voltage
2.7V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8020HL/C1,118 Datasheet
Download the complete datasheet for NXP TDA8020HL/C1,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.