PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP TDA8023TT/C1/S1,11 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
9.8(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Typical Operating Supply Voltage
3.3|5V
Maximum Supply Current
200mA
Maximum Clock Frequency
20MHz
Standard Supported
EMV 2000/GSM 11.11/ISO 7816-3
Maximum Power Dissipation
500mW
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
6.5V
Min Operating Supply Voltage
2.7V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8023TT/C1/S1,11 Datasheet
Download the complete datasheet for NXP TDA8023TT/C1/S1,11 to view detailed technical specifications.
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