The TDA8023TT/C1/S1,11 is a 28-pin TSSOP lead-frame SMT interface IC from NXP, supporting EMV 2000, GSM 11.11, and ISO 7816-3 standards. It operates over a temperature range of -40°C to 85°C, with a maximum supply voltage of 6.5V and a maximum supply current of 200mA. The device has a maximum power dissipation of 500mW and a typical operating supply voltage of 3.3V or 5V. It is mounted on a surface mount and has a package material of plastic, with a seated plane height of 1.1mm and a pin pitch of 0.65mm.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 9.8(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Typical Operating Supply Voltage | 3.3|5V |
| Maximum Supply Current | 200mA |
| Maximum Clock Frequency | 20MHz |
| Standard Supported | EMV 2000/GSM 11.11/ISO 7816-3 |
| Maximum Power Dissipation | 500mW |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 6.5V |
| Min Operating Supply Voltage | 2.7V |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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