The TDA8029HL/C206,118 is a 32-pin LQFP lead-frame SMT specialized interface IC from NXP. It features a low profile quad flat package with gull-wing leads and a seated plane height of 1.6mm maximum. The IC is designed for surface mount applications and is packaged in a plastic LQFP with a pin pitch of 0.8mm. The package dimensions are 7mm in length and width, and 1.4mm in height. The IC is compliant with the MS-026BBA Jedec standard.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA8029HL/C206,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 7 |
| Package Width (mm) | 7 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BBA |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8029HL/C206,118 Datasheet
Download the complete datasheet for NXP TDA8029HL/C206,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.