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Technical Specifications
NXP TDA8050AT D technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
20.7(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-119
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TDA8050AT D Datasheet
Download the complete datasheet for NXP TDA8050AT D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.