40-pin HVQFN EP demodulator for surface mount applications. Features a 6mm x 6mm x 0.83mm thermal enhanced plastic package with exposed pad and 0.5mm pin pitch. Operates from 1.08V to 3.63V with a maximum supply current of 0.179A and power dissipation of 631mW. Programmable device with an operating temperature range of -20°C to 85°C.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP TDA8295HN/C2/S1,51 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 6 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.83 |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220 |
| Device Type | Demodulator |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 85°C |
| Programmability | Yes |
| Min Operating Supply Voltage | 1.08|2.97V |
| Typical Operating Supply Voltage | 1.2|3.3V |
| Max Operating Supply Voltage | 1.32|3.63V |
| Maximum Power Dissipation | 631mW |
| Maximum Supply Current | 0.179A |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8295HN/C2/S1,51 Datasheet
Download the complete datasheet for NXP TDA8295HN/C2/S1,51 to view detailed technical specifications.
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