PackageDBS13P
MountingThrough Hole
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Technical Specifications
NXP TDA8560Q/N1C,112 technical specifications.
General
Package/Case
DBS13P
Pin Count
13
PCB
13
Package Length (mm)
24(Max)
Package Width (mm)
4.6(Max)
Package Height (mm)
12.2(Max)
Pin Pitch (mm)
1.7
Package Material
Plastic
Mounting
Through Hole
Function
Speaker
Amplifier Type
Class-B
Input Signal Type
Single
Output Signal Type
Differential
Output Type
2-Channel Stereo
Maximum Output Current
10000mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8560Q/N1C,112 Datasheet
Download the complete datasheet for NXP TDA8560Q/N1C,112 to view detailed technical specifications.
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