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NXP TDA8566TH/N2C,118 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | HSOP |
| Package/Case | HSOP |
| Package Description | Heat Sinked Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 16(Max) |
| Package Width (mm) | 11.1(Max) |
| Package Height (mm) | 3.5(Max) |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Speaker |
| Amplifier Type | Class-B |
| Input Signal Type | Differential |
| Output Signal Type | Differential |
| Output Type | 2-Channel Stereo |
| Maximum Output Current | 10000mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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