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Technical Specifications
NXP TDA8588AJ/N3/R1,11 technical specifications.
General
Basic Package Type
Through Hole
Package/Case
DBS37P
Lead Shape
Through Hole
Pin Count
37
PCB
37
Package Length (mm)
42.2(Max)
Package Width (mm)
4.65(Max)
Package Height (mm)
15.9(Max)
Seated Plane Height (mm)
19
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Through Hole
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8588AJ/N3/R1,11 Datasheet
Download the complete datasheet for NXP TDA8588AJ/N3/R1,11 to view detailed technical specifications.
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