The NXP TDA8588BJ/N3,112 is a 37-pin DBSP through-hole audio amplifier. It has a maximum package length of 42.2mm, width of 4.65mm, and height of 15.9mm. The seated plane height is 19mm. The package is made of plastic and is designed for through-hole mounting.
PackageDBSP
MountingThrough Hole
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Technical Specifications
NXP TDA8588BJ/N3,112 technical specifications.
General
| Package Family Name | DBSP |
| Package/Case | DBSP |
| Lead Shape | Through Hole |
| Pin Count | 37 |
| PCB | 37 |
| Tab | Tab |
| Package Length (mm) | 42.2(Max) |
| Package Width (mm) | 4.65(Max) |
| Package Height (mm) | 15.9(Max) |
| Seated Plane Height (mm) | 19 |
| Package Material | Plastic |
| Mounting | Through Hole |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8588BJ/N3,112 Datasheet
Download the complete datasheet for NXP TDA8588BJ/N3,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.