PackageRDBSP
MountingThrough Hole
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Technical Specifications
NXP TDA8594SD/N1,112 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
RDBSP
Package/Case
RDBSP
Lead Shape
Through Hole
Pin Count
27
PCB
27
Package Length (mm)
29.2(Max)
Package Width (mm)
15.9(Max)
Package Height (mm)
4.65(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Through Hole
Function
Speaker
Amplifier Type
Class-AB
Input Signal Type
Single
Output Signal Type
Differential
Output Type
4-Channel Stereo
Maximum Output Current
13000mA
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8594SD/N1,112 Datasheet
Download the complete datasheet for NXP TDA8594SD/N1,112 to view detailed technical specifications.
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