PackageHSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP TDA8595TH/N2C,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
36
PCB
36
Package Length (mm)
16(Max)
Package Width (mm)
11.1(Max)
Package Height (mm)
3.5(Max)
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-AB
Input Signal Type
Differential
Output Signal Type
Differential
Output Type
4-Channel Stereo
Maximum Output Current
13000mA
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8595TH/N2C,118 Datasheet
Download the complete datasheet for NXP TDA8595TH/N2C,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.