The TDA8953TH/N1 is a 24-pin lead-frame SMT package, heat sinked small outline package, with a maximum package length of 16mm, width of 11.1mm, and height of 3.5mm. It is a surface mount device with a pin pitch of 1mm and a maximum seated plane height of 3.5mm. The amplifier is a class-D type, with a maximum output current of 12,000mA and an operating temperature range of -40°C to 85°C.
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NXP TDA8953TH/N1 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | HSOP |
| Package/Case | HSOP |
| Package Description | Heat Sinked Small Outline Package |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 16(Max) |
| Package Width (mm) | 11.1(Max) |
| Package Height (mm) | 3.5(Max) |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Speaker |
| Amplifier Type | Class-D |
| Input Signal Type | Differential |
| Output Signal Type | Differential|Single |
| Output Type | 1-Channel Mono|2-Channel Stereo |
| Maximum Output Current | 12000(Min)mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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