PackageDBS23P
MountingThrough Hole
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Technical Specifications
NXP TDA8954J technical specifications.
General
Package/Case
DBS23P
Pin Count
23
PCB
23
Package Length (mm)
30.4(Max)
Package Width (mm)
4.6(Max)
Package Height (mm)
12.2(Max)
Seated Plane Height (mm)
16.9(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Through Hole
Function
Speaker
Amplifier Type
Class-D
Input Signal Type
Differential
Output Signal Type
Differential|Single
Output Type
1-Channel Mono|2-Channel Stereo
Maximum Output Current
12000(Min)mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TDA8954J Datasheet
Download the complete datasheet for NXP TDA8954J to view detailed technical specifications.
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