The TDA9881TS/V2,518 is a specialized IC in a 24-pin SSOP package, featuring a lead-frame SMT construction and a seated plane height of 2mm. It has a pin pitch of 0.65mm and is made of plastic. The IC is designed for surface mount applications and is compliant with the MO-150AG Jedec standard.
Sign in to ask questions about the NXP TDA9881TS/V2,518 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP TDA9881TS/V2,518 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8.4(Max) |
| Package Width (mm) | 5.4(Max) |
| Package Height (mm) | 1.8(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-150AG |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP TDA9881TS/V2,518 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
