The TDA9884TS/V1/S1,11 is a specialized IC from NXP, packaged in a 24-pin SSOP lead-frame SMT package. It has a seated plane height of 2mm and a pin pitch of 0.65mm. The package material is plastic and is designed for surface mount applications. The IC is compliant with the MO-150AG Jedec standard.
PackageSSOP
MountingSurface Mount
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Technical Specifications
NXP TDA9884TS/V1/S1,11 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8.4(Max) |
| Package Width (mm) | 5.4(Max) |
| Package Height (mm) | 1.8(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-150AG |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA9884TS/V1/S1,11 Datasheet
Download the complete datasheet for NXP TDA9884TS/V1/S1,11 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.