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NXP TDA9885HN/V3/S1 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 5.1(Max) |
| Package Height (mm) | 0.85 - 0.05(Max) |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220VHHD-2 |
| Category | I2C Bus Controlled Single and IF PLL Demodulator |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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