The TDA9885HN/V5 is a surface mount IC with a thermal enhanced very thin quad flat package and exposed pad. It operates over a temperature range of -20 to 85 degrees Celsius. The device is a specialized IC for multimedia applications, with a package material of plastic and a pin pitch of 0.5mm.
Sign in to ask questions about the NXP TDA9885HN/V5 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP TDA9885HN/V5 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 5.1(Max) |
| Package Height (mm) | 0.85 - 0.05(Max) |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220VHHD-2 |
| Category | I2C Bus Controlled Single and IF PLL Demodulator |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP TDA9885HN/V5 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
