The TDA9885HN/V5,151 is a 32-pin surface mount device in a thermal enhanced very thin quad flat package with exposed pad. It is a specialized IC for multimedia applications, operating between -20°C and 85°C. The package measures 5.1mm in length and width, with a height of 0.85mm to 0.05mm maximum. It is a non-lead-frame SMT package with a pin pitch of 0.5mm.
Sign in to ask questions about the NXP TDA9885HN/V5,151 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP TDA9885HN/V5,151 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 5.1(Max) |
| Package Height (mm) | 0.85 - 0.05(Max) |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220VHHD-2 |
| Category | I2C Bus Controlled Single and IF PLL Demodulator |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP TDA9885HN/V5,151 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
