The TDF8554J/N2,112 is a SIL packaged audio amplifier from NXP, suitable for through hole mounting. It operates over a temperature range of -40°C to 105°C and can handle supply voltages between 6V and 18V. This device is RoHS compliant and not radiation hardened.
PackageSIL
MountingThrough Hole
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Technical Specifications
NXP TDF8554J/N2,112 technical specifications.
General
| Package/Case | SIL |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 18V |
| Min Supply Voltage | 6V |
| Mount | Through Hole |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Voltage Gain | 26dB |
Compliance
| RoHS | Compliant |
Datasheet
No datasheet is available for this part.