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Technical Specifications
NXP TEA1069N/C1 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | SDIP |
| Package Description | Skinny Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 42 |
| PCB | 42 |
| Package Length (mm) | 38.9(Max) |
| Package Width (mm) | 14(Max) |
| Package Height (mm) | 4(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-020 |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP TEA1069N/C1 Datasheet
Download the complete datasheet for NXP TEA1069N/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.