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Technical Specifications
NXP TEA1533TD technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TEA1533TD Datasheet
Download the complete datasheet for NXP TEA1533TD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.