The TEA1713T/N2,518 is a surface mount power management IC from NXP, packaged in a SO case and available in quantities of 1000 per reel. It is designed to operate over a temperature range of -20°C to 150°C and is compliant with lead-free standards. This device is suitable for use in a variety of applications, including those that require radiation hardening. The TEA1713T/N2,518 is a RoHS compliant component.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP TEA1713T/N2,518 technical specifications.
General
| Package/Case | SO |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -20°C |
| Mount | Surface Mount |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP TEA1713T/N2,518 Datasheet
Download the complete datasheet for NXP TEA1713T/N2,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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