The TEA1755T/1,518 is a flyback PFC controller from NXP, designed for surface mount applications. It features over voltage and over temperature fault protection, and is compliant with RoHS regulations. Operating within a temperature range of -40°C to 155°C, this device can dissipate up to 250W of power. It is packaged in a lead-free SOIC-16 package, suitable for cut tape packaging.
PackageSOIC
MountingSurface Mount
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Technical Specifications
NXP TEA1755T/1,518 technical specifications.
General
| Package/Case | SOIC |
| Fault Protection | Over Voltage, Over Temperature |
| Lead Free | Lead Free |
| Max Operating Temperature | 155°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 250W |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| RoHS Compliant | Yes |
| Series | GreenChip™ |
| Topology | Flyback |
Compliance
| RoHS | Compliant |
Datasheet
NXP TEA1755T/1,518 Datasheet
Download the complete datasheet for NXP TEA1755T/1,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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