PackageSOIC
MountingSurface Mount
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Technical Specifications
NXP TEA1755T/1,518 technical specifications.
General
Package/Case
SOIC
Fault Protection
Over Voltage, Over Temperature
Lead Free
Lead Free
Max Operating Temperature
155°C
Min Operating Temperature
-40°C
Max Power Dissipation
250W
Mount
Surface Mount
Packaging
Cut Tape
RoHS Compliant
Yes
Series
GreenChip™
Topology
Flyback
Compliance
RoHS
Compliant
Datasheet
NXP TEA1755T/1,518 Datasheet
Download the complete datasheet for NXP TEA1755T/1,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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