The TEF6890H/V3,518 is a specialized IC in a 44-pin PQFP package with a lead-frame SMT construction. It has a maximum package length of 10.1mm, width of 10.1mm, and height of 1.85mm. The seated plane height is 2.1mm, and the pin pitch is 0.8mm. The package material is plastic, and it is designed for surface mount applications.
PackagePQFP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP TEF6890H/V3,518 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | PQFP |
| Package Description | Plastic Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 44 |
| PCB | 44 |
| Package Length (mm) | 10.1(Max) |
| Package Width (mm) | 10.1(Max) |
| Package Height (mm) | 1.85(Max) |
| Seated Plane Height (mm) | 2.1(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TEF6890H/V3,518 Datasheet
Download the complete datasheet for NXP TEF6890H/V3,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.