Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the NXP TFA9887UK/N1,023 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP TFA9887UK/N1,023 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 29 |
| PCB | 29 |
| Package Length (mm) | 3.19 |
| Package Width (mm) | 2.07 |
| Package Height (mm) | 0.36 |
| Seated Plane Height (mm) | 0.6(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Speaker |
| Amplifier Type | Class-D |
| Typical PSRR | 90dB |
| Input Signal Type | Single |
| Output Signal Type | Differential |
| Output Type | 1-Channel Mono |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP TFA9887UK/N1,023 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
