28-pin SSOP telecom IC for cordless telephones, featuring a lead-frame SMT construction with gull-wing leads. This shrink small outline package, measuring 10.4mm x 5.4mm x 1.8mm, offers a 0.65mm pin pitch and is designed for surface mounting. Operating within a 3V to 5.5V supply voltage range, it consumes a typical 2.2mA and functions across temperatures from -25°C to 75°C. Supports transmission via cable, copper, and twisted pair.
PackageSSOP
MountingSurface Mount
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Technical Specifications
NXP UBA1707TS/C1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 10.4(Max) |
| Package Width (mm) | 5.4(Max) |
| Package Height (mm) | 1.8(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-150AH |
| Category | Cordless Telephone |
| Transmission Media Type | Cable|Copper|Twisted Pair |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 3V |
| Power Supply Type | Analog |
| Typical Supply Current | 2.2mA |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 75°C |
| Typical Operating Supply Voltage | 3.3|5V |
Compliance
| Cage Code | H1R01 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP UBA1707TS/C1 Datasheet
Download the complete datasheet for NXP UBA1707TS/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.