28-pin SSOP telecom IC for cordless telephones, featuring a lead-frame SMT construction with gull-wing leads. This shrink small outline package, measuring 10.4mm x 5.4mm x 1.8mm, offers a 0.65mm pin pitch and is designed for surface mounting. Operating within a 3V to 5.5V supply voltage range, it consumes a typical 2.2mA and functions across temperatures from -25°C to 75°C. Supports transmission via cable, copper, and twisted pair.
PackageSSOP
MountingSurface Mount
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Technical Specifications
NXP UBA1707TS/C1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
10.4(Max)
Package Width (mm)
5.4(Max)
Package Height (mm)
1.8(Max)
Seated Plane Height (mm)
2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-150AH
Category
Cordless Telephone
Transmission Media Type
Cable|Copper|Twisted Pair
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
3V
Power Supply Type
Analog
Typical Supply Current
2.2mA
Min Operating Temperature
-25°C
Max Operating Temperature
75°C
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP UBA1707TS/C1 Datasheet
Download the complete datasheet for NXP UBA1707TS/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.