The UBA2024AT/DB/230VS is a 14-pin SO lead-frame SMT power management IC from NXP. It has a package length of 8.75mm, width of 4mm, and height of 1.45mm, with a seated plane height of 1.75mm and a pin pitch of 1.27mm. The IC is designed for surface mount applications and is made of plastic. It is a part of the SOP package family and has a small outline IC description.
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NXP UBA2024AT/DB/230VS technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.75(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP UBA2024AT/DB/230VS to view detailed technical specifications.
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