PackageSO
MountingSurface Mount
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Technical Specifications
NXP UZZ9000,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
15.6(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AD
Input Type
Analog
Sensor Type
Temperature Sensor
Output Type
Digital
Interface Type
Serial
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP UZZ9000,118 Datasheet
Download the complete datasheet for NXP UZZ9000,118 to view detailed technical specifications.
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