32-bit RISC microprocessor operating at 200 MHz, featuring a single MPC603e core with 16KB instruction and 16KB data cache. This surface-mount component is housed in a 352-pin Thin Profile Ball Grid Array (TBGA) package with a 1.27mm pin pitch, measuring 35x35mm with a maximum height of 1.05mm. It supports a maximum operating supply voltage of 2.756775V and operates within a temperature range of 0°C to 105°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
NXP XPC8240LZU200C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 352 |
| PCB | 352 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | PowerQUICC II |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | MPC603e |
| Maximum Speed | 200MHz |
| Core Architecture | MPC603e |
| Number of CPU Cores | 1 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 2.75625|2.756775V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 105°C |
| Instruction Cache Size | 16KB |
| Data Cache Size | 16KB |
| Multiply Accumulate | No |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP XPC8240LZU200C Datasheet
Download the complete datasheet for NXP XPC8240LZU200C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.