32-bit RISC microprocessor operating at 200 MHz, featuring a single MPC603e core with 16KB instruction and 16KB data cache. This surface-mount component is housed in a 352-pin Thin Profile Ball Grid Array (TBGA) package with a 1.27mm pin pitch, measuring 35x35mm with a maximum height of 1.05mm. It supports a maximum operating supply voltage of 2.756775V and operates within a temperature range of 0°C to 105°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
NXP XPC8240LZU200C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
352
PCB
352
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC II
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
MPC603e
Maximum Speed
200MHz
Core Architecture
MPC603e
Number of CPU Cores
1
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
2.75625|2.756775V
Min Operating Temperature
0°C
Max Operating Temperature
105°C
Instruction Cache Size
16KB
Data Cache Size
16KB
Multiply Accumulate
No
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP XPC8240LZU200C Datasheet
Download the complete datasheet for NXP XPC8240LZU200C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.