32-bit RISC microprocessor featuring a PowerQUICC MPC8xx core operating at 80 MHz. This surface-mount component utilizes a 0.32um process technology and offers a 357-pin BGA package with a 1.27mm pin pitch. Integrated peripherals include I2C and SPI interfaces, along with one UART. The processor boasts 4KB instruction and 4KB data cache, with a maximum operating supply voltage of 3.6V.
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP XPC860SRZP80D3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
357
PCB
357
Package Length (mm)
25
Package Width (mm)
25
Package Height (mm)
1.35(Max)
Seated Plane Height (mm)
2.05(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC MPC8xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
PowerQUICC
Maximum Speed
80MHz
Process Technology
0.32um
Number of CPU Cores
1
Interface Type
I2C/SPI/UART
CAN
0
UART
1
USART
0
I2C
1
SPI
1
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
3.465|3.6V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Instruction Cache Size
4KB
Data Cache Size
4KB
Multiply Accumulate
No
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP XPC860SRZP80D3 Datasheet
Download the complete datasheet for NXP XPC860SRZP80D3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.