Quick Jump:
Technical Specifications
Onsemi ASM3P2108AF-08-TR technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3.1(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AA |
| Number of Outputs per Chip | 1 |
| Input Logic Level | Crystal |
| Clock Input Frequency | 25 to 45MHz |
| Min Operating Supply Voltage | 4.75V |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Onsemi ASM3P2108AF-08-TR Datasheet
Download the complete datasheet for Onsemi ASM3P2108AF-08-TR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.