PackageTSSOP
MountingSurface Mount
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Technical Specifications
Onsemi ASM3P2108AF-08-TT technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3.1(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AA
Number of Outputs per Chip
1
Input Logic Level
Crystal
Clock Input Frequency
25 to 45MHz
Min Operating Supply Voltage
4.75V
Max Operating Supply Voltage
5.25V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Onsemi ASM3P2108AF-08-TT Datasheet
Download the complete datasheet for Onsemi ASM3P2108AF-08-TT to view detailed technical specifications.
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