Uni-directional diode array for circuit protection, featuring a 10-pin MSOP package with gull-wing leads for surface mounting. This component offers a maximum working voltage of 5.5V and a maximum power dissipation of 400mW, with a typical clamping voltage of 9.9V and a low leakage current of 1uA. It includes four ESD suppressor elements per chip, with a capacitance of 2pF, operating within a temperature range of -40°C to 85°C. The lead-frame SMT package measures 3mm x 3mm x 0.85mm with a 0.5mm pin pitch.
PackageMSOP
Capacitance2pF
MountingSurface Mount
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Technical Specifications
Onsemi CM1293A-04MR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
MSOP
Package Description
Micro Small Outline Package
Lead Shape
Gull-wing
Pin Count
10
PCB
10
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.85
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-187BA
Configuration
Quad
Type
Diode Array
Direction Type
Uni-Directional
Maximum Working Voltage
5.5V
Maximum Power Dissipation
400mW
Maximum Clamping Voltage
9.9(Typ)V
Maximum Leakage Current
1uA
Capacitance
2pF
Number of Elements per Chip
4
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi CM1293A-04MR Datasheet
Download the complete datasheet for Onsemi CM1293A-04MR to view detailed technical specifications.
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