Positive-edge triggered D-type bus interface flip-flop, featuring 1 element with 8 inputs and 8 non-inverting outputs. This surface-mount integrated circuit utilizes bipolar process technology and is housed in a 20-pin SOIC W wide body package with gull-wing leads. Operating within a temperature range of 0°C to 70°C, it offers a 1.27mm pin pitch and is designed for lead-frame SMT mounting.
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Onsemi DM74LS273WM technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 12.8 |
| Package Width (mm) | 7.5 |
| Package Height (mm) | 2.35(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AC |
| Logic Family | LS |
| Logic Function | D-Type Bus Interface |
| Process Technology | Bipolar |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 8 |
| Number of Element Outputs | 8 |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | 5V1P1 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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