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Technical Specifications
Onsemi FAN1655MTF_35 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP EP |
| Package Description | Thin Shrink Small Outline Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 5 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153ABT |
Compliance
| Cage Code | 5V1P1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Onsemi FAN1655MTF_35 Datasheet
Download the complete datasheet for Onsemi FAN1655MTF_35 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.