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Technical Specifications
Onsemi FAN1655MTF_35 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP EP
Package Description
Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5
Package Width (mm)
4.4
Package Height (mm)
0.9
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153ABT
Compliance
Cage Code
5V1P1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Onsemi FAN1655MTF_35 Datasheet
Download the complete datasheet for Onsemi FAN1655MTF_35 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.