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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 16 |
| PCB | 16 |
| Package Height (mm) | 0.38 |
| Seated Plane Height (mm) | 0.63(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Segments | 6 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3.3|5V |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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Product discontinuance notice for various onsemi components including USB transceivers, analog switches, and power management ICs. Last time buy date is January 16, 2020.
