The FAN5701UC30X is a 16-pin Ball Grid Array Power Management IC from Onsemi, packaged in a Wafer Level Chip Scale Package with a plastic material and a surface mount configuration. It operates over a temperature range of -40°C to 85°C and is supplied with a voltage between 2.7V and 5.5V. The device is designed for use in a variety of applications, including those requiring a typical operating supply voltage of 3.3V or 5V.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Onsemi FAN5701UC30X datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 16 |
| PCB | 16 |
| Package Height (mm) | 0.38 |
| Seated Plane Height (mm) | 0.63(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Segments | 6 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3.3|5V |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Onsemi FAN5701UC30X to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
These are design resources that include the Onsemi FAN5701UC30X
Product discontinuance notice for various onsemi components including USB transceivers, analog switches, and power management ICs. Last time buy date is January 16, 2020.
