The FAN6300HNY is a Dual In Line Package flyback IC with a minimum supply voltage of 15V and a maximum supply voltage of 17V. It has a package type of Through Hole and a package family name of DIP. The IC is designed for use in through hole mounting and has a package length of 9.83mm, a package width of 6.67mm, and a package height of 3.68mm. The FAN6300HNY operates within a temperature range of -40 to 125 degrees Celsius.
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| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | DIP |
| Package Description | Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 9.83(Max) |
| Package Width (mm) | 6.67(Max) |
| Package Height (mm) | 3.68 |
| Pin Pitch (mm) | 2.54 |
| Mounting | Through Hole |
| Topology | Flyback |
| Minimum Supply Voltage | 15V |
| Maximum Supply Voltage | 17V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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These are design resources that include the Onsemi FAN6300HNY
Product discontinuance notice P318A from Fairchild Semiconductor detailing discontinued parts, suggested replacements, and end-of-life order deadlines issued in March 2013.
