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Technical Specifications
Onsemi FIN210ACGFX technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
42
PCB
42
Package Length (mm)
4.5
Package Width (mm)
3.5
Package Height (mm)
0.72(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi FIN210ACGFX Datasheet
Download the complete datasheet for Onsemi FIN210ACGFX to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.