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Technical Specifications
Onsemi FIN224CMLX technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
MLP EP
Package Description
Micro Lead Frame Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.75(Max)
Seated Plane Height (mm)
0.8(Max)
Package Material
Plastic
Mounting
Surface Mount
Function
Serializer/Deserializer
Number of Drivers
2/24
Number of Receivers
24/2
Input Signal Type
LVCMOS
Number of Elements per Chip
2
Min Operating Temperature
-30°C
Max Operating Temperature
70°C
Typical Operating Supply Voltage
1.8|2.5|3.3V
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi FIN224CMLX Datasheet
Download the complete datasheet for Onsemi FIN224CMLX to view detailed technical specifications.
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