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Technical Specifications
Onsemi FIN224CMLX technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | MLP EP |
| Package Description | Micro Lead Frame Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 6 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.75(Max) |
| Seated Plane Height (mm) | 0.8(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Serializer/Deserializer |
| Number of Drivers | 2/24 |
| Number of Receivers | 24/2 |
| Input Signal Type | LVCMOS |
| Number of Elements per Chip | 2 |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 70°C |
| Typical Operating Supply Voltage | 1.8|2.5|3.3V |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi FIN224CMLX Datasheet
Download the complete datasheet for Onsemi FIN224CMLX to view detailed technical specifications.
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