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Technical Specifications
Onsemi FIN425CMLX technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
MLP EP
Package Description
Micro Lead Frame Package, Exposed Pad
Lead Shape
No Lead
Pin Count
32
PCB
32
Package Length (mm)
5
Package Width (mm)
5
Package Height (mm)
0.75(Max)
Seated Plane Height (mm)
0.8(Max)
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi FIN425CMLX Datasheet
Download the complete datasheet for Onsemi FIN425CMLX to view detailed technical specifications.
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