
N-Channel Power MOSFET featuring 900V drain-to-source breakdown voltage and 6A continuous drain current. This single-element transistor offers a low 2.3 Ohm drain-to-source resistance (Rds On Max) and a maximum power dissipation of 198W. Designed for through-hole mounting in a TO-3P/TO-3PN package, it operates within a temperature range of -55°C to 150°C. Key switching characteristics include a 35ns turn-on delay, 55ns turn-off delay, and 60ns fall time.
Onsemi FQA6N90C-F109 technical specifications.
| Continuous Drain Current (ID) | 6A |
| Drain to Source Breakdown Voltage | 900V |
| Drain to Source Resistance | 2.3R |
| Drain to Source Voltage (Vdss) | 900V |
| Element Configuration | Single |
| Fall Time | 60ns |
| Gate to Source Voltage (Vgs) | 30V |
| Height | 18.9mm |
| Input Capacitance | 1.77nF |
| Length | 15.8mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 198W |
| Mount | Through Hole |
| Package Quantity | 30 |
| Packaging | Rail/Tube |
| Polarity | N-CHANNEL |
| Power Dissipation | 198W |
| Rds On Max | 2.3R |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Series | QFET® |
| Threshold Voltage | 5V |
| Turn-Off Delay Time | 55ns |
| Turn-On Delay Time | 35ns |
| Weight | 6.401g |
| Width | 5mm |
| RoHS | Compliant |
Download the complete datasheet for Onsemi FQA6N90C-F109 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
