The FSBH0170WNY is a power management IC available in an 8-pin PDIP package with a plastic dual in line package description. It has a through hole lead shape and is mounted through a hole. The package measures 10.16mm in length, 7.11mm in width, and 3.81mm in height, with a seated plane height of 5.33mm and a pin pitch of 2.54mm. The package material is plastic.
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Onsemi FSBH0170WNY technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 10.16(Max) |
| Package Width (mm) | 7.11(Max) |
| Package Height (mm) | 3.81(Max) |
| Seated Plane Height (mm) | 5.33(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Onsemi FSBH0170WNY to view detailed technical specifications.
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