The FSL137HNY is a power management IC available in an 8-pin PDIP package with through hole mounting. It has a plastic dual in line package with a maximum package length of 9.83mm, width of 6.67mm, and height of 3.68mm. The seated plane height is 5.08mm with a pin pitch of 2.54mm. The package material is plastic.
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| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 9.83(Max) |
| Package Width (mm) | 6.67(Max) |
| Package Height (mm) | 3.68(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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