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Technical Specifications
Onsemi LV5216CS-TE-L-E technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLP |
| Package Description | Wafer Level Package |
| Lead Shape | Ball |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 2.97 |
| Package Width (mm) | 2.97 |
| Package Height (mm) | 0.55(Max) - 0.14 |
| Seated Plane Height (mm) | 0.55(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Segments | 3 |
| Output Voltage | 5(Typ)V |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 75°C |
| Max Operating Supply Voltage | 4.5V |
| Maximum Power Dissipation | 850mW |
| Min Operating Supply Voltage | 1.7V |
| Typical Operating Supply Voltage | 1.8|2.5|3.3V |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi LV5216CS-TE-L-E Datasheet
Download the complete datasheet for Onsemi LV5216CS-TE-L-E to view detailed technical specifications.
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