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Technical Specifications
Onsemi MC10H101FN technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | LLCC |
| Package/Case | PLLC |
| Package Description | Plastic Leaded Chip Carrier |
| Lead Shape | J-Lead |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 9.04(Max) |
| Package Width (mm) | 9.04(Max) |
| Package Height (mm) | 3.69(Min) |
| Seated Plane Height (mm) | 4.57(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | ECL |
| Logic Function | OR/NOR |
| Process Technology | ECL |
| Number of Elements per Chip | 4 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 2 |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 75°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi MC10H101FN Datasheet
Download the complete datasheet for Onsemi MC10H101FN to view detailed technical specifications.
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