PackageCDIP
MountingThrough Hole
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Technical Specifications
Onsemi MC10H125L technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.93(Max)
Package Width (mm)
7.49(Max)
Package Height (mm)
4.07(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Jedec
MS-030AC
Logic Family
ECL
Logic Function
Translator
Process Technology
ECL
Translation
MECL to TTL
Maximum Low Level Output Current
20mA
Maximum High Level Output Current
-1mA
Min Operating Temperature
0°C
Max Operating Temperature
75°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MC10H125L Datasheet
Download the complete datasheet for Onsemi MC10H125L to view detailed technical specifications.
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