Dual JK-type flip-flop IC, negative-edge triggered, featuring two elements per chip. This surface-mount logic component utilizes bipolar process technology and is housed in a 16-pin SOIC package (MS-012AC) with gull-wing leads. The package dimensions are 10mm (L) x 4mm (W) x 1.5mm (H) with a 1.27mm pin pitch. Operating temperature range is 0°C to 70°C.
PackageSOIC
MountingSurface Mount
PolarityInverting/Non-Inverting
Quick Jump:
Technical Specifications
Onsemi MC74F112DR2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
| Logic Family | F |
| Logic Function | JK-Type |
| Process Technology | Bipolar |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2 |
| Number of Element Outputs | 1 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Negative-Edge |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi MC74F112DR2 Datasheet
Download the complete datasheet for Onsemi MC74F112DR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.